SLIP 20th IEEE/ACM International Workshop on System-Level Interconnect Prediction 2018
Linnaeus University

San Francisco California

23 June 2018 - 23 June 2018

http://sliponline.org

SLIP 20th IEEE/ACM International Workshop on System-Level Interconnect Prediction 2018

Event Description
  • The 20th ACM/IEEE System Level Interconnect Prediction 2018 workshop will take place at the Moscone Center West, San Francisco, CA on June 23, 2018. It will be co-located with 55th ACM/EDAC/IEEE Design Automation Conference, June 24-28, 2018.

  • Technical topics include but are not limited to:
    • Interconnect prediction and optimization at various IC and system design stages
    • System-level design for FPGAs, NoCs, reconfigurable systems
    • Design, analysis, and optimization of power and clock networks
    • Interconnect reliability Interconnect topologies and fabrics of multi- and many-core architectures
    • Design-for-manufacturing (DFM) and yield techniques for interconnects
    • High speed chip-to-chip interconnect design
    • Design and analysis of chip-package interfaces
    • Power consumption of interconnects
    • 3D interconnect design and prediction
    • Applications of interconnects to social, genetic, and biological systems
    • Co-optimization of interconnect technology and chip design
    • Emerging interconnect technologies in machine learning platforms & chips

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Departments That Are Eligible for Participated In this Fest :
  • Computer Science and Engineering
  • Information Technology
Event Categories In This Fest:
  • Workshop

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